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 MC10ELT22, MC100ELT22 5.0 V Dual TTL to Differential PECL Translator
The MC10ELT/100ELT22 is a dual TTL to differential PECL translator. Because PECL (Positive ECL) levels are used only +5 V and ground are required. The small outline 8-lead package and the low skew, dual gate design of the ELT22 makes it ideal for applications which require the translation of a clock and a data signal.
Features http://onsemi.com MARKING DIAGRAMS*
8 1 SO-8 D SUFFIX CASE 751 1 8 HLT22 ALYW G 8 KLT22 ALYW G
* * * * * * *
1.2 ns Typical Propagation Delay < 300 ps Typical Output to Output Skew PNP TTL Inputs for Minimal Loading Flow Through Pinouts Operating Range: VCC = 4.75 V to 5.25 V with GND = 0 V No Internal Input Pulldown Resistors Pb-Free Packages are Available
1
8 1 TSSOP-8 DT SUFFIX CASE 948R
8 HT22 ALYWG G 1
8 KT22 ALYWG G
1
H = MC10 K = MC100 A = Assembly Location L = Wafer Lot Y = Year W = Work Week G = Pb-Free Package (Note: Microdot may be in either location) *For additional information, see Application Note AND8002/D.
ORDERING INFORMATION
See detailed ordering and shipping information in the package dimensions section on page 5 of this data sheet.
(c) Semiconductor Components Industries, LLC, 2006
November, 2006 - Rev. 9
1
Publication Order Number: MC10ELT22/D
MC10ELT22, MC100ELT22
Table 1. PIN DESCRIPTION
Q0 1 8 VCC Qn, Qn Q0 2 PECL Q1 3 TTL 6 D1 7 D0 Dn VCC GND Pin Function PECL Differential Outputs* TTL Inputs Positive Supply Ground
*Output state undetermined when inputs are open.
Q1
4
5
GND
Figure 1. Logic Diagram and Pinout Assignment
Table 2. ATTRIBUTES
Characteristics Internal Input Pulldown Resistor Internal Input Pullup Resistor ESD Protection Human Body Model Machine Model Value N/A N/A > 2 kV > 200 V Level 1 UL 94 V-0 @ 0.125 in 51
Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1) Flammability Rating Transistor Count Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test 1. For additional information, see Application Note AND8003/D. Oxygen Index: 28 to 34
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2
MC10ELT22, MC100ELT22
Table 3. MAXIMUM RATINGS
Symbol VCC VIN Iout TA Tstg qJA qJC qJA qJC Tsol Parameter Positive Power Supply Input Voltage Output Current Operating Temperature Range Storage Temperature Range Thermal Resistance (Junction-to-Ambient) Thermal Resistance (Junction-to-Case) Thermal Resistance (Junction-to-Ambient) Thermal Resistance (Junction-to-Case) Wave Solder 0 lfpm 500 lfpm Standard Board 0 lfpm 500 lfpm Standard Board <2 to 3 sec @ 248C 8 SOIC 8 SOIC 8 SOIC 8 TSSOP 8 TSSOP 8 TSSOP Condition 1 GND = 0 V GND = 0 V Continuous Surge Condition 2 Rating 7 GND + 0.025 v VI v VCC - 0.025 50 100 -40 to +85 -65 to +150 190 130 41 to 44 185 140 41 to 44 5% 265 Units V V mA mA C C C/W C/W C/W C/W C/W C/W C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.
Table 4. 10ELT SERIES PECL DC CHARACTERISTICS VCC = 5.0 V; GND = 0.0 V (Note 2)
-40C Symbol ICC VOH VOL Characteristic Power Supply Current Output HIGH Voltage (Note 3) Output LOW Voltage (Note 3) 3920 3050 4010 3200 Min Typ Max 22 4110 3350 4020 3050 4105 3210 Min 25C Typ Max 22 4190 3370 4090 3050 4185 3227 Min 85C Typ Max 22 4280 3405 Unit mA mV mV
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 2. Output parameters vary 1:1 with VCC. VCC can vary 0.25 V. 3. Outputs are terminated through a 50 W resistor to VCC - 2.0 V.
Table 5. 100ELT SERIES PECL DC CHARACTERISTICS VCC = 5.0 V; GND = 0.0 V (Note 4)
-40C Symbol ICC VOH VOL Characteristic Power Supply Current Output HIGH Voltage (Note 5) Output LOW Voltage (Note 5) 3915 3170 3995 3305 Min Typ Max 22 4120 3445 3975 3190 4045 3295 Min 25C Typ Max 22 4120 3380 3975 3190 4050 3295 Min 85C Typ Max 22 4120 3380 Unit mA mV mV
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 4. Output parameters vary 1:1 with VCC. VCC can vary 0.25 V. 5. Outputs are terminated through a 50 W resistor to VCC - 2.0 V.
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3
MC10ELT22, MC100ELT22
Table 6. TTL INPUT DC CHARACTERISTICS VCC = 4.75 V to 5.25 V; TA = -40C to 85C
Symbol IIH IIHH IIL VIK VIH VIL Characteristic Input HIGH Current Input HIGH Current Input LOW Current Input Clamp Diode Voltage Input HIGH Voltage Input LOW Voltage Condition VIN = 2.7 V; VIN = (VCC - 0.025) V VIN = 7.0 V VIN = 0.5 V; VIN = (GND + 0.025) V IIN = -18 mA 2.0 GND + 0.025 V Min Typ Max 20 100 -0.6 -1.2 VCC - 0.025 V 0.8 Unit mA mA mA V V V
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously.
Table 7. AC CHARACTERISTICS VCC= 4.75 V to 5.25 V; GND= 0.0 V
-40C Symbol fMAX tPLH tPHL tskew tJITTER tr/tf Characteristic Maximum Input Frequency Propagation Delay (Note 6) 1.5 V to 50% Propagation Delay (Note 6) 1.5 V to 50% Within-Device Skew (Note 7) Device-to-Device Skew (Note 8) CLOCK Random Jitter (RMS) Output Rise/Fall Time (20-80%) 0.4 1.6 0.4 0.6 0.4 50 300 1.2 1.0 100 600 0.9 0.5 Min Typ Max Min 25C Typ 500 1.2 0.8 50 300 0.5 1.6 0.4 1.6 1.5 1.1 100 600 0.6 0.7 50 350 1.35 1.30 100 750 Max Min 85C Typ Max Unit MHz ns ns ps ps ns
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 6. Specifications for standard TTL input signal. 7. Skew is measured between outputs under identical transitions and conditions on any one device. 8. Device-to-Device Skew for identical transitions at identical VCC levels.
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4
MC10ELT22, MC100ELT22
Q Driver Device Q Zo = 50 W 50 W 50 W D Zo = 50 W D Receiver Device
VTT VTT = VCC - 2.0 V
Figure 2. Typical Termination for Output Driver and Device Evaluation (See Application Note AND8020/D - Termination of ECL Logic Devices.)
ORDERING INFORMATION
Device MC10ELT22D MC10ELT22DG MC10ELT22DR2 MC10ELT22DR2G MC10ELT22DT MC10ELT22DTG MC10ELT22DTR2 MC10ELT22DTR2G MC100ELT22D MC100ELT22DG MC100ELT22DR2 MC100ELT22DR2G MC100ELT22DT MC100ELT22DTG MC100ELT22DTR2 MC100ELT22DTR2G Package SO-8 SO-8 (Pb-Free) SO-8 SO-8 (Pb-Free) TSSOP-8 TSSOP-8 (Pb-Free) TSSOP-8 TSSOP-8 (Pb-Free) SO-8 SO-8 (Pb-Free) SO-8 SO-8 (Pb-Free) TSSOP-8 TSSOP-8 (Pb-Free) TSSOP-8 TSSOP-8 (Pb-Free) Shipping 98 Units / Rail 98 Units / Rail 2500 Tape & Reel 2500 Tape & Reel 100 Units / Rail 100 Units / Rail 2500 Tape & Reel 2500 Tape & Reel 98 Units / Rail 98 Units / Rail 2500 Tape & Reel 2500 Tape & Reel 100 Units / Rail 100 Units / Rail 2500 Tape & Reel 2500 Tape & Reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D.
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5
MC10ELT22, MC100ELT22
Resource Reference of Application Notes
AN1405/D AN1406/D AN1503/D AN1504/D AN1568/D AN1672/D AND8001/D AND8002/D AND8020/D AND8066/D AND8090/D - ECL Clock Distribution Techniques - Designing with PECL (ECL at +5.0 V) - ECLinPSt I/O SPiCE Modeling Kit - Metastability and the ECLinPS Family - Interfacing Between LVDS and ECL - The ECL Translator Guide - Odd Number Counters Design - Marking and Date Codes - Termination of ECL Logic Devices - Interfacing with ECLinPS - AC Characteristics of ECL Devices
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6
MC10ELT22, MC100ELT22
PACKAGE DIMENSIONS
SOIC-8 NB CASE 751-07 ISSUE AH
-X-
A
8 5
B
1
S
4
0.25 (0.010)
M
Y
M
-Y- G
K
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. 751-01 THRU 751-06 ARE OBSOLETE. NEW STANDARD IS 751-07. MILLIMETERS MIN MAX 4.80 5.00 3.80 4.00 1.35 1.75 0.33 0.51 1.27 BSC 0.10 0.25 0.19 0.25 0.40 1.27 0_ 8_ 0.25 0.50 5.80 6.20 INCHES MIN MAX 0.189 0.197 0.150 0.157 0.053 0.069 0.013 0.020 0.050 BSC 0.004 0.010 0.007 0.010 0.016 0.050 0_ 8_ 0.010 0.020 0.228 0.244
C -Z- H D 0.25 (0.010)
M SEATING PLANE
N
X 45 _
0.10 (0.004)
M
J
ZY
S
X
S
DIM A B C D G H J K M N S
SOLDERING FOOTPRINT*
1.52 0.060
7.0 0.275
4.0 0.155
0.6 0.024
1.270 0.050
SCALE 6:1 mm inches
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
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7
MC10ELT22, MC100ELT22
PACKAGE DIMENSIONS
TSSOP-8 DT SUFFIX PLASTIC TSSOP PACKAGE CASE 948R-02 ISSUE A
K REF 0.10 (0.004)
2X M
8x
0.15 (0.006) T U
S
TU
S
V
S
L/2
8 1
5
L
PIN 1 IDENT
4
B -U-
0.25 (0.010) M
0.15 (0.006) T U
S
A -V-
F DETAIL E
NOTES: 1. DIMENSIONS AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH. PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 6. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE -W-. MILLIMETERS MIN MAX 2.90 3.10 2.90 3.10 0.80 1.10 0.05 0.15 0.40 0.70 0.65 BSC 0.25 0.40 4.90 BSC 0_ 6_ INCHES MIN MAX 0.114 0.122 0.114 0.122 0.031 0.043 0.002 0.006 0.016 0.028 0.026 BSC 0.010 0.016 0.193 BSC 0_ 6_
C 0.10 (0.004) -T- SEATING
PLANE
D
G DETAIL E
-W-
DIM A B C D F G K L M
ECLinPS is a trademark of Semiconductor Components Industries, LLC (SCILLC).
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5773-3850 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative
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8
MC10ELT22/D


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